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  invensense inc. 1197 borregas ave, sunnyvale, ca 94089 u.s.a. tel: +1 (408) 988-7339 fax: +1 (408) 988-8104 website: www.invensense.com document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 1 of 52 mpu-9150 product specification revision 4.0
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 2 of 52 contents 1 revision history .................................. ................................................... .............................................. 5 2 purpose and scope ................................. ................................................... ......................................... 6 3 product overview .................................. ................................................... .......................................... 7 3.1 mpu-9150 o verview .................................................. ................................................... ................... 7 4 applications ...................................... ................................................... .................................................. 8 5 features .......................................... ................................................... ................................................... .. 9 5.1 g yroscope f eatures .................................................. ................................................... .................. 9 5.2 a ccelerometer f eatures .................................................. ................................................... .......... 9 5.3 m agnetometer f eatures ................................................... ................................................... ........... 9 5.4 a dditional f eatures .................................................. ................................................... ................... 9 5.5 m otion p rocessing .................................................. ................................................... .................... 10 5.6 c locking .................................................. ................................................... .................................... 10 6 electrical characteristics ........................ ................................................... .............................. 11 6.1 g yroscope s pecifications .................................................. ................................................... ....... 11 6.2 a ccelerometer s pecifications .................................................. ................................................... 12 6.3 m agnetometer s pecifications .................................................. ................................................... . 13 6.4 e lectrical and o ther c ommon s pecifications .................................................. .......................... 14 6.5 e lectrical s pecifications , c ontinued .................................................. ....................................... 15 6.6 e lectrical s pecifications , c ontinued .................................................. ....................................... 16 6.7 e lectrical s pecifications , c ontinued .................................................. ....................................... 17 6.8 i 2 c t iming c haracterization ................................................... ................................................... .... 18 6.9 a bsolute m aximum r atings .................................................. ................................................... ...... 19 7 applications information .......................... ................................................... ................................. 20 7.1 p in o ut and s ignal d escription .................................................. .................................................. 20 7.2 t ypical o perating c ircuit .................................................. ................................................... ........ 21 7.3 b ill of m aterials for e xternal c omponents .................................................. ............................ 21 7.4 r ecommended p ower - on p rocedure .................................................. ......................................... 22 7.5 b lock d iagram .................................................. ................................................... .......................... 23 7.6 o verview .................................................. ................................................... ................................... 23 7.7 t hree -a xis mems g yroscope with 16- bit adc s and s ignal c onditioning ................................ 24 7.8 t hree -a xis mems a ccelerometer with 16- bit adc s and s ignal c onditioning ........................ 24 7.9 t hree -a xis mems m agnetometer with 13- bit adc s and s ignal c onditioning ......................... 24
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 3 of 52 7.10 d igital m otion p rocessor .................................................. ................................................... ....... 24 7.11 p rimary i 2 c ................................................. ................................................... ................................. 24 7.12 a uxiliary i 2 c s erial i nterface .................................................. ................................................... . 25 7.13 s elf -t est .................................................. ................................................... ................................... 25 7.14 mpu-9150 s olution for 10-a xis s ensor f usion u sing i 2 c i nterface ........................................ 26 7.15 p rocedure for d irectly a ccessing the ak8975 3-a xis c ompass ............................................. 28 7.16 i nternal c lock g eneration .................................................. ................................................... ..... 28 7.17 s ensor d ata r egisters .................................................. ................................................... ............ 29 7.18 fifo .............................................. ................................................... ............................................... 29 7.19 i nterrupts .................................................. ................................................... ................................. 29 7.20 d igital -o utput t emperature s ensor .................................................. ........................................ 29 7.21 b ias and ldo ............................................... ................................................... ................................ 30 7.22 c harge p ump .................................................. ................................................... ............................. 30 8 programmable interrupts ........................... ................................................... .............................. 31 8.1 m otion i nterrupt .................................................. ................................................... ...................... 32 9 digital interface ................................. ................................................... ........................................... 33 9.1 i 2 c s erial i nterface .................................................. ................................................... ................. 33 9.2 i 2 c i nterface .................................................. ................................................... ............................. 33 9.3 i 2 c c ommunications p rotocol .................................................. ................................................... . 33 9.4 i 2 c t erms .................................................. ................................................... ................................... 36 10 serial interface considerations ................... ................................................... ......................... 37 10.1 mpu-9150 s upported i nterfaces .................................................. ............................................... 37 10.2 l ogic l evels .................................................. ................................................... .............................. 37 10.3 l ogic l evels d iagram .................................................. ................................................... ............... 38 11 assembly .......................................... ................................................... .................................................. 39 11.1 o rientation of a xes .................................................. ................................................... ................. 39 11.2 p ackage d imensions .................................................. ................................................... ................. 40 11.3 pcb d esign g uidelines : ................................................. ................................................... ............. 41 11.4 a ssembly p recautions .................................................. ................................................... ............. 42 11.5 r eflow s pecification .................................................. ................................................... ............... 44 11.6 s torage s pecifications .................................................. ................................................... ............ 45 11.7 p ackage m arking s pecification .................................................. .................................................. 45 11.8 t ape & r eel s pecification .................................................. ................................................... ........ 46 11.9 l abel .................................................. ................................................... .......................................... 48
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 4 of 52 11.10 p ackaging .................................................. ................................................... .............................. 49 11.11 r epresentative s hipping c arton l abel .................................................. ................................. 50 12 reliability ....................................... ................................................... ................................................... 51 12.1 q ualification t est p olicy .................................................. ................................................... ........ 51 12.2 q ualification t est p lan .................................................. ................................................... ........... 51 13 environmental compliance .......................... ................................................... .............................. 52
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 5 of 52 1 revision history revision date revision description 5/27/2011 1.0 initial release of product specificat ion 06/14/2011 2.0 modified for rev c silicon (sections 5.2, 6.2, 6.4, 6.6, 8.2, 8.3, 8.4) edits for clarity (several sections) 10/21/2011 2.1 updated supply current vs. operating modes (section s 5.3, 5.4, 6.4) modified self-test response of accelerometers (sect ion 6.2) modified absolute maximum rating for acceleration ( section 6.9) updated latch up current rating (sections 6.9, 12.2 ) modified package dimensions and pcb design guidelin es (sections 11.2, 11.3) updated assembly precautions (section 11.4) updated qualification test plan (section 12.2) edits for clarity (several sections) 10/24/2011 3.0 modified for rev d silicon (sections 6.2, 8.2, 8.3, 8.4) edits for clarity (several sections) 12/23/2011 3.1 updated package dimensions (section 11.2) 5/14/2012 4.0 added gyroscope specifications (section 6.1) added accelerometer specifications (section 6.2) updated electrical other common specifications (sec tion 6.3) updated latch-up information (section 6.9) updated block diagram (section 7.5) update self-test description (section 7.13) updated pcb design guidelines (section 11.3) updated packing and shipping information (sections 11.8, 11.9, 11.10, 11.11) updated reliability references (section 12.2)
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 6 of 52 2 purpose and scope this product specification provides preliminary inf ormation regarding the electrical specification and design related information for the mpu-9150? motion proces sing unit? or mpu?. electrical characteristics are based upon design an alysis and simulation results only. specifications are subject to change without notice. final specificati ons will be updated based upon characterization of production silicon. for references to register map and descriptions of individual registers, please re fer to the mpu-9150 register map and register descriptions doc ument.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 7 of 52 3 product overview 3.1 mpu-9150 overview motioninterface? is becoming a ?must-have? function being adopted by smartphone and tablet manufacturers due to the enormous value it adds to the end user experience. in smartphones, it finds u se in applications such as gesture commands for applicati ons and phone control, enhanced gaming, augmented reality, panoramic photo capture and viewing, and p edestrian and vehicle navigation. with its ability to precisely and accurately track user motions, motion tracking technology can convert handsets and tablet s into powerful 3d intelligent devices that can be us ed in applications ranging from health and fitness monitoring to location-based services. key require ments for motioninterface enabled devices are small package size, low power consumption, high accuracy and repeatability, high shock tolerance, and applic ation specific performance programmability ? all at a low consumer price point. the mpu-9150 is the world?s first integrated 9-axis motiontracking device that combines a 3-axis mems gyroscope, a 3-axis mems accelerometer, a 3-axis me ms magnetometer and a digital motion processor? (dmp?) hardware accelerator engine. the mpu-9150 i s an ideal solution for handset and tablet applications, game controllers, motion pointer remo te controls, and other consumer devices. the mpu- 9150?s 9-axis motionfusion combines acceleration an d rotational motion plus heading information into a single data stream for the application. this motion processing? technology integration provides a small er footprint and has inherent cost advantages compared to discrete gyroscope, accelerometer, plus magnetometer solutions. the mpu-9150 is also desig ned to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary i 2 c port to produce a 10-axis sensor fusion output. the mpu-9150 is a 3 rd generation motion processor and is footprint compa tible with the mpu-60x0 and mpu- 30x0 families. the mpu-9150 features three 16-bit analog-to-digita l converters (adcs) for digitizing the gyroscope ou tputs ,three 16-bit adcs for digitizing the accelerometer outputs and three 13-bit adcs for digitizing the magnetometer outputs. for precision tracking of bot h fast and slow motions, the parts feature a user- programmable gyroscope full-scale range of 250, 5 00, 1000, and 2000/sec (dps), a user- programmable accelerometer full-scale range of 2 g , 4 g , 8 g , and 16 g , and a magnetometer full-scale range of 1200t. the mpu-9150 is a multi-chip module (mcm) consistin g of two dies integrated into a single lga package. one die houses the 3-axis gyroscope and the 3-axis accelerometer. the other die houses the ak8975 3- axis magnetometer from asahi kasei microdevices cor poration. an on-chip 1024 byte fifo buffer helps lower system power consumption by allowing the system processor to read the sensor data in bursts and then enter a low-power mode as the mpu collects more data. with all the necessary on-chip processing and sensor compone nts required to support many motion-based use cases, the mpu-9150 uniquely supports a variety of advanced motion-based applications entirely on-chip . the mpu-9150 thus enables low-power motionprocessin g in portable applications with reduced processing requirements for the system processor. by providing an integrated motionfusion output, the dmp in the mpu-9150 offloads the intensive motionprocessing co mputation requirements from the system processor, minimizing the need for frequent polling of the mot ion sensor output. communication with all registers of the device is p erformed using i 2 c at 400khz. additional features include an embedded temperature sensor and an on-chip oscil lator with 1% variation over the operating temperature range. by leveraging its patented and volume-proven nasiri -fabrication platform, which integrates mems wafers with companion cmos electronics through wafer-level bonding, invensense has driven the mpu-9150 package size down to a revolutionary footprint of 4 x4x1mm (lga), while providing the highest performan ce, lowest noise, and the lowest cost semiconductor pac kaging required for handheld consumer electronic devices. the part features a robust 10,000 g shock tolerance, and has programmable low-pass fil ters for the gyroscopes, accelerometers, magnetometers, and the on-chip temperature sensor.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 8 of 52 4 applications ? blurfree ? technology (for video/still image stabilization) ? airsign ? technology (for security/authentication) ? touchanywhere ? technology (for ?no touch? ui application control /navigation) ? motioncommand ? technology (for gesture short-cuts) ? motion-enabled game and application framework ? instantgesture? ig? gesture recognition ? location based services, points of interest, and d ead reckoning ? handset and portable gaming ? motion-based game controllers ? 3d remote controls for internet connected dtvs and set top boxes, 3d mice ? wearable sensors for health, fitness and sports ? toys ? pedestrian based navigation ? navigation ? electronic compass
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 9 of 52 5 features 5.1 gyroscope features the triple-axis mems gyroscope in the mpu-9150 incl udes a wide range of features: ? digital-output x-, y-, and z-axis angular rate sen sors (gyroscopes) with a user-programmable full- scale range of 250, 500, 1000, and 2000/sec ? external sync signal connected to the fsync pin su pports image, video and gps synchronization ? integrated 16-bit adcs enable simultaneous samplin g of gyros ? enhanced bias and sensitivity temperature stabilit y reduces the need for user calibration ? improved low-frequency noise performance ? digitally-programmable low-pass filter ? factory calibrated sensitivity scale factor ? user self-test 5.2 accelerometer features the triple-axis mems accelerometer in mpu-9150 incl udes a wide range of features: ? digital-output 3-axis accelerometer with a program mable full scale range of 2 g , 4 g , 8 g and 16 g ? integrated 16-bit adcs enable simultaneous samplin g of accelerometers while requiring no external multiplexer ? orientation detection and signaling ? tap detection ? user-programmable interrupts ? high-g interrupt ? user self-test 5.3 magnetometer features the triple-axis mems magnetometer in mpu-9150 inclu des a wide range of features: ? 3-axis silicon monolithic hall-effect magnetic sen sor with magnetic concentrator ? wide dynamic measurement range and high resolution with lower current consumption. ? output data resolution is 13 bit (0.3 t per lsb) ? full scale measurement range is 1200 t ? self-test function with internal magnetic source t o confirm magnetic sensor operation on end products 5.4 additional features the mpu-9150 includes the following additional feat ures: ? 9-axis motionfusion via on-chip digital motion pro cessor (dmp) ? auxiliary master i 2 c bus for reading data from external sensors (e.g., pressure sensor) ? flexible vlogic reference voltage supports multipl e i 2 c interface voltages ? smallest and thinnest package for portable devices : 4x4x1mm lga ? minimal cross-axis sensitivity between the acceler ometer, gyroscope and magnetometer axes ? 1024 byte fifo buffer reduces power consumption by allowing host processor to read the data in bursts and then go into a low-power mode as the mpu collects more data ? digital-output temperature sensor ? user-programmable digital filters for gyroscope, a ccelerometer, and temp sensor ? 10,000 g shock tolerant
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 10 of 52 ? 400khz fast mode i 2 c for communicating with all registers ? mems structure hermetically sealed and bonded at w afer level ? rohs and green compliant 5.5 motionprocessing ? internal digital motion processing? (dmp?) engine supports 3d motionprocessing and gesture recognition algorithms ? the mpu-9150 collects gyroscope, accelerometer and magnetometer data while synchronizing data sampling at a user defined rate. the total dataset obtained by the mpu-9150 includes 3-axis gyroscope data, 3-axis accelerometer data, 3-axis m agnetometer data, and temperature data. ? the fifo buffers the complete data set, reducing t iming requirements on the system processor by allowing the processor burst read the fifo data. af ter burst reading the fifo data, the system processor can save power by entering a low-power sl eep mode while the mpu collects more data. ? programmable interrupt supports features such as g esture recognition, panning, zooming, scrolling, zero-motion detection, tap detection, and shake det ection ? digitally-programmable low-pass filters. ? low-power pedometer functionality allows the host processor to sleep while the dmp maintains the step count. 5.6 clocking ? on-chip timing generator 1% frequency variation o ver full temperature range ? optional external clock inputs of 32.768khz or 19. 2mhz
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 11 of 52 6 electrical characteristics 6.1 gyroscope specifications vdd = 2.375v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameter conditions min typ max units notes gyroscope sensitivity full-scale range fs_sel=0 250 o/s fs_sel=1 500 o/s fs_sel=2 1000 o/s fs_sel=3 2000 o/s gyroscope adc word length 16 bits sensitivity scale factor fs_sel=0 131 lsb/(o/s) fs_sel=1 65.5 lsb/(o/s) fs_sel=2 32.8 lsb/(o/s) fs_sel=3 16.4 lsb/(o/s) sensitivity scale factor tolerance 25c -3 +3 % sensitivity scale factor variation over temperature -40c to +85c 0.04 %/c nonlinearity best fit straight line; 25c 0.2 % cross-axis sensitivity 2 % gyroscope zero-rate output (zro) initial zro tolerance component level (25c) 20 o/s zro variation over temperature -40c to +85c 20 o/s self-test response change from factory trim -14 14 % gyroscope noise performance fs_sel=0 total rms noise dlpfcfg=2 (92hz) 0.06 o/s-rms rate noise spectral density at 10hz 0.005 o/s/ hz gyroscope mechanical frequencies x-axis 30 33 36 khz y-axis 27 30 33 khz z-axis 24 27 30 khz low pass filter response programmable range 5 256 hz output data rate programmable 4 8,000 hz gyroscope start-up time dlpfcfg=0 zro settling to 1o/s of final 30 ms
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 12 of 52 6.2 accelerometer specifications vdd = 2.375v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameter conditions min typ max units notes accelerometer sensitivity full-scale range afs_sel=0 2 g afs_sel=1 4 g afs_sel=2 8 g afs_sel=3 16 g adc word length output in two?s complement format 16 bits sensitivity scale factor afs_sel=0 16,384 lsb/ g afs_sel=1 8,192 lsb/ g afs_sel=2 4,096 lsb/ g afs_sel=3 2,048 lsb/ g initial calibration tolerance 3 % sensitivity change vs. temperature afs_sel=0, -40c to +85c 0.02 %/c nonlinearity best fit straight line 0.5 % zero-g output initial calibration tolerance x and y axes 80 m g z axis 150 m g change over specified temperature ? component level -25c to 85c x & y axis z axis 0.75 1.50 mg/c mg/c self-test response change from factory trim -14 14 % noise performance power spectral density total rms noise x, y & z axes, @10hz, afs_sel=0 & odr=1khz afs = 0 @100hz 400 4 g / hz mg-rms low pass filter response programmable range 5 260 hz output data rate programmable range 4 1,000 hz intelligence function increment 32 m g /lsb
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 13 of 52 6.3 magnetometer specifications vdd = 2.375v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c the information in the following table is from the akm ak8975 datasheet. parameter conditions min typ max units notes magnetometer sensitivity full-scale range 1200 t adc word length output in two?s complement format 13 bits sensitivity scale factor 0.285 0.3 0.315 t /lsb zero-field output initial calibration tolerance -1000 1000 lsb self-test response x-axis y-axis z-axis -100 -100 -1000 100 100 -300 lsb
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 14 of 52 6.4 electrical and other common specifications vdd = 2.375v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameter conditions min typ max units notes temperature sensor range -40 to +85 c sensitivity untrimmed 340 lsb/oc temperature offset 35 o c -521 lsb linearity best fit straight line (-40c to +85c) 1 c vdd power supply operating voltages 2.375 3.465 v power supply ramp rate monotonic ramp. ramp rate is 10% to 90% of the final value 100 ms operating current normal operating current gyro at all rates accel at 1khz sample rate magnetometer at 8hz repetition rate gyro+accel (magnetometer and dmp disabled) 3.9 ma accel + magnetometer (gyro and dmp disabled) 900 a magnetometer only (dmp, gyro, and accel disabled) 350 a accelerometer low power mode current 1.25 hz update rate 10 a 5 hz update rate 20 hz update rate 40 hz update rate 20 70 140 a a a magnetometer full power mode current 100% duty cycle 6 ma full-chip idle mode supply current 6 a vlogic reference voltage voltage range vlogic must be vdd at all times 1.71 vdd v power supply ramp rate monotonic ramp. ramp rate is 10% to 90% of the final value 3 ms normal operating current 100 a temperature range specified temperature range performance parameters are not applicable beyond sp ecified temperature range -40 +85 c
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 15 of 52 6.5 electrical specifications, continued vdd = 2.375v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameter conditions min typ max units notes serial interface i 2 c operating frequency all registers, fast-mode 40 0 khz all registers, standard-mode 100 khz i 2 c address ad0 = 0 1101000 ad0 = 1 1101001 digital inputs (sda, ad0, scl, fsync, clkin) v ih , high level input voltage 0.7*vlogic v v il , low level input voltage 0.3*vlogic v c i , input capacitance < 5 pf digital output (int) v oh , high level output voltage r load =1m  0.9*vlogic v v ol1 , low-level output voltage r load =1m  0.1*vlogic v v ol.int1 , int low-level output voltage open=1, 0.3ma sink current 0.1 v output leakage current open=1 100 na t int , int pulse width latch_int_en=0 50 s digital output (clkout) v oh , high level output voltage v ol1 , low-level output voltage rload=1m  rload=1m  0.9*vdd 0.1*vdd v v
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 16 of 52 6.6 electrical specifications, continued typical operating circuit of section 7.2, vdd = 2.3 75v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameters conditions typical units notes primary i 2 c i/o (scl, sda) vil, low level input voltage -0.5v to 0.3*vlogic v vih, high-level input voltage 0.7*vlogic to vlogic + 0.5v v vhys, hysteresis 0.1*vlogic v v ol1 , low-level output voltage 3ma sink current 0 to 0. 4 v i ol , low-level output current v ol = 0.4v 3 ma v ol = 0.6v 5 ma output leakage current 100 na t of , output fall time from v ihmax to v ilmax c b bus capacitance in pf 20+0.1c b to 250 ns c i , capacitance for each i/o pin < 10 pf auxiliary i 2 c i/o (es_cl, es_da) v il , low-level input voltage -0.5 to 0.3*vdd v v ih , high-level input voltage 0.7*vdd to vdd+0.5v v v hys , hysteresis 0.1*vdd v v ol1 , low-level output voltage 1ma sink current 0 to 0. 4 v i ol , low-level output current v ol = 0.4v v ol = 0.6v 1 1 ma ma output leakage current 100 na t of , output fall time from v ihmax to v ilmax c b bus cap. in pf 20+0.1c b to 250 ns c i , capacitance for each i/o pin < 10 pf
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 17 of 52 6.7 electrical specifications, continued typical operating circuit of section 7.2, vdd = 2.3 75v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameters conditions min typical max units notes internal clock source clk_sel=0,1,2,3 gyroscope sample rate, fast dlpfcfg=0 sampleratediv = 0 8 khz gyroscope sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz accelerometer sample rate 1 khz reference clock output clkouten = 1 1.024 mhz clock frequency initial tolerance clk_sel=0, 25c -5 +5 % clk_sel=1,2,3; 25c -1 +1 % frequency variation over temperature clk_sel=0 -15 to +10 % clk_sel=1,2,3 1 % pll settling time clk_sel=1,2,3 1 ms external 32.768khz clock clk_sel=4 external clock frequency 32.768 khz external clock allowable jitter cycle-to-cycle rms 1 to 2 s gyroscope sample rate, fast dlpfcfg=0 sampleratediv = 0 8.192 khz gyroscope sample rate, slow dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1.024 khz accelerometer sample rate 1.024 khz reference clock output clkouten = 1 1.0486 mhz pll settling time 1 ms external 19.2mhz clock clk_sel=5 external clock frequency 19.2 mhz gyroscope sample rate full programmable range 3.9 8000 hz gyroscope sample rate, fast mode dlpfcfg=0 sampleratediv = 0 8 khz gyroscope sample rate, slow mode dlpfcfg=1,2,3,4,5, or 6 sampleratediv = 0 1 khz accelerometer sample rate 1 khz reference clock output clkouten = 1 1.024 mhz pll settling time 1 ms
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 18 of 52 6.8 i 2 c timing characterization typical operating circuit of section 7.2, vdd = 2.3 75v-3.465v, vlogic= 1.8v5% or vdd, t a = 25c parameters conditions min typical max units notes i 2 c timing i 2 c fast-mode f scl , scl clock frequency 400 khz t hd.sta , (repeated) start condition hold time 0.6 s t low , scl low period 1.3 s t high , scl high period 0.6 s t su.sta , repeated start condition setup time 0.6 s t hd.dat , sda data hold time 0 s t su.dat , sda data setup time 100 ns t r , sda and scl rise time c b bus cap. from 10 to 400pf 20+0.1c b 300 ns t f , sda and scl fall time c b bus cap. from 10 to 400pf 20+0.1c b 300 ns t su.sto , stop condition setup time 0.6 s t buf , bus free time between stop and start condition 1.3 s c b , capacitive load for each bus line < 400 pf t vd.dat , data valid time 0.9 s t vd.ack , data valid acknowledge time 0.9 s i 2 c bus timing diagram
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 19 of 52 6.9 absolute maximum ratings stress above those listed as ?absolute maximum rati ngs? may cause permanent damage to the device. these are stress ratings only and functional operat ion of the device at these conditions is not implie d. exposure to the absolute maximum ratings conditions for extended periods may affect device reliability . parameter rating supply voltage, vdd -0.5v to +6v vlogic input voltage level -0.5v to vdd + 0.5v regout -0.5v to 2v input voltage level (clkin, aux_da, ad0, fsync, int, scl, sda) -0.5v to vdd + 0.5v cpout (2.5v vdd 3.6v ) -0.5v to 30v acceleration (any axis, unpowered) 10,000g for 0.2m s operating temperature range -40c to +105c storage temperature range -40c to +125c electrostatic discharge (esd) protection 2kv (hbm); 200v (mm) latch-up jedec class ii (2),125c 100ma
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 20 of 52 7 applications information 7.1 pin out and signal description pin number pin name pin description 1 clkin optional external reference clock input. connect t o gnd if unused. 6 es_da auxiliary i 2 c master serial data 7 es_cl auxiliary i 2 c master serial clock 8 vlogic digital i/o supply voltage 9 ad0 i 2 c slave address lsb (ad0) 10 regout regulator filter capacitor connection 11 fsync frame synchronization digital input. connect to gnd if unused. 12 int interrupt digital output (totem pole or open-drain) 3, 13 vdd power supply voltage and digital i/o supply voltage 15, 17,18 gnd power supply ground 20 cpout charge pump capacitor connection 22 clkout system clock output 23 scl i 2 c serial clock (scl) 24 sda i 2 c serial data (sda) 2, 4, 5, 14, 16, 19, 21 resv reserved. do not connect. m p u - 9 1 5 0 +z +x +y 7 8 9 10 11 12 es_cl vlogic ad0 regout fsync int 13 18 17 16 15 14 resv gnd resv vdd gnd gnd 6 1 2 3 4 5 vdd resv resv es_da resv clkin 24 23 22 21 20 19 resv cpout resv clkout scl sda mpu-9150 lga package 24-pin, 4mm x 4mm x 1mm orientation of axes of sensitivity and polarity of rotation for accel & gyro top view +z +y +x m p u - 9 1 5 0 +z +x +y orientation of axes of sensitivity for magnetometer
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 21 of 52 7.2 typical operating circuit typical operating circuits ad0 7 8 9 10 11 12 13 18 17 16 15 14 6 1 2 3 4 5 24 23 22 21 20 19 mpu-9150 clkin gnd gnd gnd fsync int gnd vdd scl sda c3 2.2nf c1 0.1 f c2 0.1 f gnd vlogic c4 10nf es_cl es_da clkout vdd 7.3 bill of materials for external components component label specification quantity regulator filter capacitor (pin 10) c1 ceramic, x7r , 0.1f 10%, 2v 1 vdd bypass capacitor (pin 13) c2 ceramic, x7r, 0.1 f 10%, 4v 1 charge pump capacitor (pin 20) c3 ceramic, x7r, 2.2 nf 10%, 50v 1 vlogic bypass capacitor (pin 8) c4* ceramic, x7r, 10nf 10%, 4v 1
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 22 of 52 7.4 recommended power-on procedure t vlgr vlogic vdd t vddr all voltages at 0v power-up sequencing 1. vlogic amplitude must always be vdd amplitude 2. t vddr is vdd rise time: time for vdd to rise from 10% to 90% of its final value 3. t vddr is 100msec 4. t vlgr is vlogic rise time: time for vlogic to rise from 10% to 90% of its final value 5. t vlgr is 3msec 6. t vlg-vdd is the delay from the start of vdd ramp to the start of vlogic rise 7. t vlg-vdd is 0ms; 8. vdd and vlogic must be monotonic ramps 90% 10% 90% 10% t vlg - vdd
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 23 of 52 7.5 block diagram clock mpu-9150 charge pump ad0 scl sda temp sensor adc adc z gyro adc y gyro digital motion processor (dmp) fsync 22 1 9 23 24 11 slave i 2c master i2c serial interface clock serial interface bypass mux 7 6 es_cl es_da int 12 factory calibration interrupt status register vdd bias & ldo gnd regout 13 18 10 z accel y accel adc adc adc clkin clkout adc x gyro signal conditioning fifo config registers sensor registers vlogic 8 signal conditioning x accel 20 cpout self test self test self test self test self test self test z compass adc y compass adc x compass adc 7.6 overview the mpu-9150 is comprised of the following key bloc ks and functions: ? three-axis mems rate gyroscope sensor with 16-bit adcs and signal conditioning ? three-axis mems accelerometer sensor with 16-bit a dcs and signal conditioning ? three-axis mems magnetometer sensor with 13-bit ad cs and signal conditioning ? digital motion processor (dmp) engine ? primary i 2 c serial communications interface ? auxiliary i 2 c serial interface for 3 rd party sensors ? clocking ? sensor data registers ? fifo ? interrupts ? digital-output temperature sensor ? gyroscope, accelerometer and magnetometer self-tes t ? bias and ldo ? charge pump
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 24 of 52 7.7 three-axis mems gyroscope with 16-bit adcs and signal conditioning the mpu-9150 includes a 3-axis vibratory mems rate gyroscope, which detect rotations about the x-, y-, and z- axes. when the gyro is are rotated about an y of the sense axes, the coriolis effect causes a vibration that is detected by a capacitive pickoff. the resulting signal is amplified, demodulated, an d filtered to produce a voltage that is proportional to the an gular rate. this voltage is digitized using indivi dual on-chip 16-bit analog-to-digital converters (adcs) to sampl e each axis. the full-scale range of the gyro sens or may be digitally programmed to 250, 500, 1000, or 2 000 degrees per second (dps). the adc sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low- pass filters enable a wide range of cut-off frequen cies. 7.8 three-axis mems accelerometer with 16-bit adcs and signal conditioning the mpu-9150?s 3-axis accelerometer uses separate p roof masses for each axis. acceleration along a particular axis induces displacement on the corresp onding proof mass, and capacitive sensors detect th e displacement differentially. the mpu-9150?s archite cture reduces the accelerometer?s susceptibility to fabrication variations as well as to thermal drift. when the device is placed on a flat surface, it wi ll measure 0g on the x- and y-axes and +1g on the z-axis. the accelerometer?s scale factor is calibrated at the f actory and is nominally independent of supply voltage. eac h sensor has a dedicated sigma-delta adc for provid ing digital outputs. the full scale range of the digita l output can be adjusted to 2 g , 4 g , 8 g , or 16 g . 7.9 three-axis mems magnetometer with 13-bit adcs a nd signal conditioning the 3-axis magnetometer uses highly sensitive hall sensor technology. the compass portion of the ic incorporates magnetic sensors for detecting terrest rial magnetism in the x-, y-, and z- axes, a sensor driving circuit, a signal amplifier chain, and an arithmeti c circuit for processing the signal from each senso r. each adc has a 13-bit resolution and a full scale range of 1200 t. 7.10 digital motion processor the embedded digital motion processor (dmp) is loca ted within the mpu-9150 and offloads computation of motion processing algorithms from the host processo r. the dmp acquires data from accelerometers, gyroscopes, magnetometers and additional 3 rd party sensors such as pressure sensors, and proces ses the data. the resulting data can be read from the dmp?s registers, or can be buffered in a fifo. the dmp h as access to one of the mpu?s external pins, which can be used for generating interrupts. the purpose of the dmp is to offload both timing re quirements and processing power from the host processor. typically, motion processing algorithms should be run at a high rate, often around 200hz, i n order to provide accurate results with low latency. this is required even if the application updates at a mu ch lower rate; for example, a low power user interface may u pdate as slowly as 5hz, but the motion processing s hould still run at 200hz. the dmp can be used as a tool i n order to minimize power, simplify timing, simplif y the software architecture, and save valuable mips on th e host processor for use in the application. 7.11 primary i 2 c the mpu-9150 communicates to a system processor usi ng an i 2 c serial interface. the mpu-9150 always acts as a slave when communicating to the system pr ocessor. the logic level for communications to the master is set by the voltage on the vlogic pin. the lsb of the of the i 2 c slave address is set by pin 9 (ad0).
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 25 of 52 7.12 auxiliary i 2 c serial interface the mpu-9150 has an auxiliary i 2 c bus for communicating to off-chip sensors. this b us has two operating modes: ? i 2 c master mode: the mpu-9150 acts as a master to any external sensors connected to the auxiliary i 2 c bus ? pass-through mode: the mpu-9150 directly connects the primary and auxiliary i 2 c buses together, allowing the system processor to directly communica te with any external sensors. auxiliary i 2 c bus modes of operation: ? i 2 c master mode: allows the mpu-9150 to directly acc ess the data registers of external digital sensors, such as a pressure sensor. in this mode, the mpu-9150 directly obtains data from auxiliary sensors, allowing the on-chip dmp to generate senso r fusion data without intervention from the system applications processor. for example, in i 2 c master mode, the mpu-9150 can be configured to pe rform burst reads, returning the following data from a triple-axis external sens or:  x-axis data (2 bytes)  y-axis data (2 bytes)  z-axis data (2 bytes) ? the i 2 c master can be configured to read up to 24 bytes f rom up to 3 auxiliary sensors. a fourth sensor can be configured to work single byte read/w rite mode. ? pass-through mode: allows an external system proce ssor to act as master and directly communicate to the external sensors connected to th e auxiliary i 2 c bus pins (es_da and escl). in this mode, the auxiliary i 2 c bus control logic (3 rd -party sensor interface block) of the mpu-9150 is disabled, and the auxiliary i 2 c pins es_da and es_cl (pins 6 and 7) are connected to the main i 2 c bus (pins 23 and 24) through analog switches. pass-through mode is useful for configuring the ext ernal sensor, or for keeping the mpu-9150 in a low-power mode when only the external sensors are u sed. in pass-through mode the system processor can still access mpu-9150 data through th e i 2 c interface. auxiliary i 2 c bus io logic level the logic level of the auxiliary i 2 c bus is vdd. for further information regarding the mpu-9150?s lo gic level, please refer to section 10.2. 7.13 self-test please refer to the register map document for more details on self-test. self-test allows for the testing of the mechanical and electrical portions of the sensors. the self-te st for each measurement axis can be activated by controlling th e bits of the gyro and accel control registers. when self-test is activated, the electronics cause the sensors to be actuated and produce an output si gnal. the output signal is used to observe the self-test response. the self-test response is defined as follows: self-test response = sensor output with self-test e nabled ? sensor output without self-test enabled
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 26 of 52 the self-test response for each accelerometer axis is defined in the accelerometer specification table (section 6.2), while that for each gyroscope axis i s defined in the gyroscope specification table (sec tion 6.1). when the value of the self-test response is within the min/max limits of the product specification, th e part has passed self-test. when the self-test response exce eds the min/max values, the part is deemed to have failed self-test. code for operating self-test cod e is included within the motionapps software provid ed by invensense. for magnetometer self-test information please refer to ?app note ? mpu-9150 factory self-test for magnetometer.? 7.14 mpu-9150 solution for 10-axis sensor fusion us ing i 2 c interface in the figure below, the system processor is an i 2 c master to the mpu-9150. in addition, the mpu-9150 is an i 2 c master to the optional external pressure sensor. the mpu-9150 has limited capabilities as an i 2 c master, and depends on the system processor to manage the i nitial configuration of any auxiliary sensors. the mpu- 9150 has an interface bypass multiplexer, which con nects the system processor i 2 c bus pins 23 and 24 (sda and scl) directly to the auxiliary sensor i 2 c bus pins 6 and 7 (es_da and es_cl). once the auxiliary sensors have been configured by the system processor, the interface bypass multiple xer should be disabled so that the mpu-9150 auxiliary i 2 c master can take control of the sensor i 2 c bus and gather data from the auxiliary sensors. for further information regarding i 2 c master control, please refer to section 10.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 27 of 52 mpu-9150 ad0/sdo scl/sclk sda/sdi digital motion processor (dmp) 9 23 24 sensor master i 2 c serial interface 7 6 es_cl es_da interrupt status register int 12 vdd bias & ldo gnd regout 13 18 10 fifo config register sensor register factory calibration /cs 8 slave i 2 c or spi serial interface pressure sensor scl sda system processor interface bypass mux scl sda vdd vdd or gnd i 2 c processor bus: for reading all sensor data from mpu and for configuring external sensors (i.e. compass in this example ) interface bypass mux allows direct configuration of compass by system processor optional sensor i 2 c bus: for configuring and reading from external sensors
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 28 of 52 7.15 procedure for directly accessing the ak8975 3- axis compass the ak8975 3-axis compass is connected to the mpu-9 150 through the mpu?s auxiliary i 2 c bus. in order to access this compass directly, the mpu-9150 should b e put into pass-through mode. for further information regarding mpu-9150 pass-thr ough mode, please refer to section 7.12. the slave address for ak8975 is 0x0c or 12 decimal. the mpu-9150 pin configuration for direct access to the ak8975 is described in the table below. pin configuration for direct access to ak8975 3-axi s compass pin number pin name pin description 1 clkin inactive. connect to gnd. 6 es_da active. leave as nc. (provision for option external pull-up resistor to vdd) 7 es_cl active. leave as nc. (provision for option external pull-up resistor to vdd) 8 vlogic active. digital i/o supply voltage. 9 ad0 active. connect to gnd. 10 regout active. connect a 100nf bypass capacitor on the boa rd. 11 fsync inactive. connect to gnd. 12 int inactive. leave as nc. 3, 13 vdd power supply voltage and digital i/o supply voltage 15, 17,18 gnd power supply ground. 20 cpout active. connect a 10nf bypass capacitor on the boar d. 22 clkout inactive. leave as nc. 23 scl active. i 2 c serial clock (scl) 24 sda active. i 2 c serial data (sda) 2, 4, 5, 14, 16, 19, 21 resv reserved. do not connect. for detailed information regarding the register map of the ak8975, please refer to the mpu-9150 regist er map and register descriptions document. 7.16 internal clock generation the mpu-9150 has a flexible clocking scheme, allowi ng a variety of internal or external clock sources to be used for the internal synchronous circuitry. this synchronous circuitry includes the signal condition ing and adcs, the dmp, and various control circuits and reg isters. an on-chip pll provides flexibility in the allowable inputs for generating this clock. allowable internal sources for generating the inter nal clock are: ? an internal relaxation oscillator ? any of the x, y, or z gyros (mems oscillators with a variation of 1% over temperature) allowable external clocking sources are: ? 32.768khz square wave ? 19.2mhz square wave
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 29 of 52 selection of the source for generating the internal synchronous clock depends on the availability of e xternal sources and the requirements for power consumption and clock accuracy. these requirements will most likely vary by mode of operation. for example, in o ne mode, where the biggest concern is power consumption, the user may wish to operate the digit al motion processor of the mpu-9150 to process accelerometer data, while keeping the gyros and mag netometer off. in this case, the internal relaxati on oscillator is a good clock choice. however, in ano ther mode, where the gyros are active, selecting th e gyros as the clock source provides for a more accurate cl ock source. clock accuracy is important, since timing errors di rectly affect the distance and angle calculations p erformed by the digital motion processor (and by extension, by any processor). there are also start-up conditions to consider. whe n the mpu-9150 first starts up, the device uses its internal clock until programmed to operate from ano ther source. this allows the user, for example, to wait for the mems oscillators to stabilize before they a re selected as the clock source. 7.17 sensor data registers the sensor data registers contain the latest gyro, accelerometer, magnetometer and temperature measurement data. they are read-only registers, an d are accessed via the serial interface. data from these registers may be read anytime. however, the interru pt function may be used to determine when new data is available. for a table of interrupt sources please refer to se ction 8. 7.18 fifo the mpu-9150 contains a 1024-byte fifo register tha t is accessible via the serial interface. the fifo configuration register determines which data is wri tten into the fifo. possible choices include gyro d ata, accelerometer data, temperature readings, auxiliary sensor readings, and fsync input. a fifo counter keeps track of how many bytes of valid data are con tained in the fifo. the fifo register supports burs t reads. the interrupt function may be used to deter mine when new data is available. for further information regarding the fifo, please refer to the mpu-9150 register map and register descriptions document. 7.19 interrupts interrupt functionality is configured via the inter rupt configuration register. items that are configu rable include the int pin configuration, the interrupt latching a nd clearing method, and triggers for the interrupt. items that can trigger an interrupt are (1) new data is availa ble to be read (from the fifo and data registers); (2) accelerometer event interrupts; and (3) the mpu-915 0 did not receive an acknowledge from an auxiliary sensor on the secondary i 2 c bus. the interrupt status can be read from the i nterrupt status register. for further information regarding interrupts, pleas e refer to the mpu-9150 register map and register descriptions document. for information regarding the mpu-9150?s accelerome ter event interrupts, please refer to section 8. 7.20 digital-output temperature sensor an on-chip temperature sensor and adc are used to m easure the mpu-9150 die temperature. the readings from the adc can be read from the fifo or the senso r data registers.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 30 of 52 7.21 bias and ldo the bias and ldo section generates the internal sup ply and the reference voltages and currents require d by the mpu-9150. its two inputs are an unregulated vd d and a vlogic logic reference supply voltage. the ldo output is bypassed by a capacitor at regout. fo r further details on the capacitor, please refer to the bill of materials for external components (section 7.3). 7.22 charge pump an on-board charge pump generates the high voltage required for the mems oscillators. its output is bypassed by a capacitor at cpout. for further detai ls on the capacitor, please refer to the bill of ma terials for external components (section 7.3).
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 31 of 52 8 programmable interrupts the mpu-9150 has a programmable interrupt system wh ich can generate an interrupt signal on the int pin . status flags indicate the source of an interrupt. i nterrupt sources may be enabled and disabled indivi dually. table of interrupt sources interrupt name module motion detection motion fifo overflow fifo data ready sensor registers i 2 c master errors: lost arbitration, nacks i 2 c master i 2 c slave 4 i 2 c master for information regarding the interrupt enable/disa ble registers and flag registers, please refer to t he mpu- 9150 register map and register descriptions documen t. some interrupt sources are explained below.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 32 of 52 8.1 motion interrupt the mpu-9150 provides motion detection capability. accelerometer measurements are passed through a configurable digital high pass filter (dhpf) in ord er to eliminate bias due to gravity. a qualifying m otion sample is one where the high passed sample from any axis has an absolute value exceeding a user- programmable threshold. a counter increments for ea ch qualifying sample, and decrements for each non- qualifying sample. once the counter reaches a user- programmable counter threshold, a motion interrupt is triggered. the axis and polarity which caused the i nterrupt to be triggered is flagged in the mot_detect_status register. motion detection has a configurable acceleration th reshold mot_thr specified in 1 m g increments. the counter threshold mot_dur is specified in 1 ms incr ements. the decrement rate for non-qualifying sampl es is also configurable. the mot_detect_ctrl register allows the user to specify whether a non-qualifying sample makes the counter reset to zero, or decremen t in steps of 1, 2, or 4. the flow chart below explains how the motion interr upt should be used. please refer to the mpu-9150 register map and register descriptions document for descriptions of the registers referenced in the fl ow chart.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 33 of 52 9 digital interface 9.1 i 2 c serial interface the internal registers and memory of the mpu-9150 c an be accessed using either i 2 c at 400 khz. serial interface pin number pin name pin description 8 vlogic digital i/o supply voltage. vlogic must be vdd at all times. 9 ad0 i 2 c slave address lsb 23 scl i 2 c serial clock 24 sda i 2 c serial data 9.2 i 2 c interface i 2 c is a two-wire interface comprised of the signals serial data (sda) and serial clock (scl). in genera l, the lines are open-drain and bi-directional. in a gener alized i 2 c interface implementation, attached devices can be a master or a slave. the master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. the mpu-9150 always operates as a slave device when communicating to the system processor, which thus acts as the master. sda and scl lines typically ne ed pull-up resistors to vdd. the maximum bus speed is 400 khz. the slave address of the mpu-9150 is b110100x which is 7 bits long. the lsb bit of the 7 bit address i s determined by the logic level on pin ad0. this allo ws two mpu-9150s to be connected to the same i 2 c bus. when used in this configuration, the address of the one of the devices should be b1101000 (pin ad0 is logic low) and the address of the other should be b110100 1 (pin ad0 is logic high). 9.3 i 2 c communications protocol start (s) and stop (p) conditions communication on the i 2 c bus starts when the master puts the start conditi on (s) on the bus, which is defined as a high-to-low transition of the sda line while scl line is high (see figure below). the bu s is considered to be busy until the master puts a stop condition (p) on the bus, which is defined as a low to high transition on the sda line while scl is high ( see figure below). additionally, the bus remains busy if a repeated st art (sr) is generated instead of a stop condition.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 34 of 52 sda scl s start condition stop condition p start and stop conditions data format / acknowledge i 2 c data bytes are defined to be 8-bits long. there is no restriction to the number of bytes transmitte d per data transfer. each byte transferred must be follo wed by an acknowledge (ack) signal. the clock for the acknowledge signal is generated by the master, whil e the receiver generates the actual acknowledge sig nal by pulling down sda and holding it low during the h igh portion of the acknowledge clock pulse. if a slave is busy and cannot transmit or receive a nother byte of data until some other task has been performed, it can hold scl low, thus forcing the ma ster into a wait state. normal data transfer resum es when the slave is ready, and releases the clock lin e (refer to the following figure). data output by transmitter (sda) data output by receiver (sda) scl from master start condition clock pulse for acknowledgement acknowledge not acknowledge 1 2 8 9 acknowledge on the i 2 c bus
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 35 of 52 communications after beginning communications with the start condi tion (s), the master sends a 7-bit slave address followed by an 8 th bit, the read/write bit. the read/write bit indica tes whether the master is receiving data from or is writing to the slave device. then, the master releases the sda line and waits for the acknowledg e signal (ack) from the slave device. each byte tran sferred must be followed by an acknowledge bit. to acknowledge, the slave device pulls the sda line lo w and keeps it low for the high period of the scl l ine. data transmission is always terminated by the maste r with a stop condition (p), thus freeing the communications line. however, the master can gener ate a repeated start condition (sr), and address another slave without first generating a stop condi tion (p). a low to high transition on the sda line while scl is high defines the stop condition. all sda cha nges should take place when scl is low, with the exception of start and stop conditions. sda start condition scl address r/w ack data ack data ack stop condition s p 1 ? 7 8 9 1 ? 7 8 9 1 ? 7 8 9 complete i 2 c data transfer to write the internal mpu-9150 registers, the maste r transmits the start condition (s), followed by th e i 2 c address and the write bit (0). at the 9 th clock cycle (when the clock is high), the mpu-9150 acknowledges the transfer. then the master puts the register address (ra) on the bus. after the mpu-9150 acknowledges t he reception of the register address, the master puts the register data onto the bus. this is followed b y the ack signal, and data transfer may be concluded by the s top condition (p). to write multiple bytes after th e last ack signal, the master can continue outputting data rather than transmitting a stop signal. in this ca se, the mpu-9150 automatically increments the register addr ess and loads the data to the appropriate register. the following figures show single and two-byte write se quences. single-byte write sequence burst write sequence master s ad+w ra data p slave ack ack ack master s ad+w ra data data p slave ack ack ack ack
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 36 of 52 to read the internal mpu-9150 registers, the master sends a start condition, followed by the i 2 c address and a write bit, and then the register address that is going to be read. upon receiving the ack signal fro m the mpu-9150, the master transmits a start signal follo wed by the slave address and read bit. as a result, the mpu-9150 sends an ack signal and the data. the comm unication ends with a not acknowledge (nack) signal and a stop bit from master. the nack conditi on is defined such that the sda line remains high a t the 9 th clock cycle. the following figures show single and two-byte read sequences. single-byte read sequence burst read sequence 9.4 i 2 c terms signal description s start condition: sda goes from high to low while scl is high ad slave i 2 c address w write bit (0) r read bit (1) ack acknowledge: sda line is low while the scl line is high at the 9 th clock cycle nack not-acknowledge: sda line stays high at the 9 th clock cycle ra mpu-9150 internal register address data transmit or received data p stop condition: sda going from low to high while scl is high master s ad+w ra s ad+r nack p slave ack ack ack data master s ad+w ra s ad+r ack nack p slave ack ack ack data data
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 37 of 52 10 serial interface considerations 10.1 mpu-9150 supported interfaces the mpu-9150 supports i 2 c communications. 10.2 logic levels the mpu-9150?s i/o logic levels are set to be eithe r vdd or vlogic, as shown in the table below. i/o logic levels microprocessor logic levels (pins: sda, scl, ad0, clkin, int) auxiliary logic levels (pins: es_da, es_cl) vlogic vdd vlogic may be set to be equal to vdd or to another voltage. however, vlogic must be vdd at all times. vlogic is the power supply voltage for the microprocessor system bus and vdd is the supply for the auxiliary i 2 c bus, as shown in the figure of section 10.3.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 38 of 52 10.3 logic levels diagram the figure below depicts a sample circuit with a th ird party pressure sensor attached to the auxiliary i 2 c bus. it shows logic levels and voltage connections. note : actual configuration will depend on the auxiliary sensors used. mpu-9150 3 rd party pressure sensor sda es_cl scl es_da vdd vdd addr int 2 int 1 system processor io clkin system bus vlogic vlogic vdd vdd vlogic scl sda int fsync vlogic ad0 (0v - vlogic ) (0v - vlogic ) (0v - vlogic ) (0v - vlogic ) (0v - vlogic) (0v - vlogic ) 0v - vdd 0v - vdd (0v, vlogic ) 0v - vdd vlogic (0v - vlogic) (0v - vlogic) vdd_io i/o levels and connections notes: 1. the io voltage levels of es_da and es_cl are set relative to vdd. 2. third-party auxiliary device logic levels are re ferenced to vdd. setting int1 and int2 to open drai n configuration provides voltage compatibility when v dd vlogic. when vdd = vlogic, int1 and int2 may be set to push-pull outputs, and external pull-up resistors are not needed. 3. clkout is referenced to vdd. 4. all other mpu-9150 logic io is always referenced to vlogic.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 39 of 52 11 assembly this section provides general guidelines for assemb ling invensense micro electro-mechanical systems (mems) gyros packaged in lead grid array package (l ga) surface mount integrated circuits. 11.1 orientation of axes the diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. note the pin 1 identifier ( ? ) in the figure. m p u - 9 1 5 0 +z +x +y orientation of axes of sensitivity and polarity of rotation for gyroscopes and accelerometers m p u - 9 1 5 0 +z +x +y orientation of axes of sensitivity for compass
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 40 of 52 11.2 package dimensions symbols dimensions in millimeters min. nom. max. a 0.90 1.00 1.10 c 0.106 0.136 0.166 d 3.90 4.00 4.10 e 3.90 4.00 4.10 d1/e1 --- 2.50 --- d2/e2 --- 3.41 --- e --- 0.50 --- b 0.22 0.25 0.28 f 0.22 0.25 0.28 l 0.32 0.35 0.38 s --- 0.12 --- x 0.32 0.35 0.38 12 d pin 1 identifier is a laser marked feature on top 16 7 13 18 19 24 7 e2 b e f pin 1 identifier 16 12 13 18 19 24 b l s s r x d2 d1 e1 a e c
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 41 of 52 11.3 pcb design guidelines: the pad diagram using a jedec type extension with s older rising on the outer edge is shown below. the pad dimensions table shows pad sizing (mean dimensi ons) recommended for the mpu-9150 product. jedec type extension with solder rising on outer ed ge pcb lay-out diagram symbols dimensions in millimeters nom nominal package i/o pad dimensions e pad pitch 0.50 b pad width 0.25 l1 pad length 0.35 l3 pad length 0.40 d package width 4.00 e package length 4.00 i/o land design dimensions (guidelines ) d2 i/o pad extent width 4.80 e2 i/o pad extent length 4.80 c land width 0.35 tout outward extension 0.40 tin inward extension 0.05 l2 land length 0.80 l4 land length 0.85 pcb dimensions table (for pcb lay-out diagram)
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 42 of 52 11.4 assembly precautions 11.4.1 surface mount guidelines invensense mems motion sensors are sensitive to mec hanical stress coming from the printed circuit boar d (pcb). this pcb stress can be minimized by adhering to certain design rules. when using mems components in plastic packages, pcb mounting and assembly can cause package stress. this package stress in turn can affect the output offset and its value over a wide range of temperatures. this stress is caused by the mismatch between the coefficient of linear thermal expansio n (cte) of the package material and the pcb. care mus t be taken to avoid package stress due to mounting. traces connected to pads should be as symmetric as possible. maximizing symmetry and balance for pad connection will help component self alignment and w ill lead to better control of solder paste reductio n after reflow. any material used in the surface mount assembly pro cess of the mems product should be free of restrict ed rohs elements or compounds. pb-free solders should be used for assembly. 11.4.2 exposed die pad precautions the mpu-9150 has very low active and standby curren t consumption. the exposed center die pad is not required for heat sinking, and should not be solder ed to the pcb. under-fill should also not be used. failure to adhere to this rule can induce performance chang es due to package thermo-mechanical stress. there i s no electrical connection between the pad and the cm os. 11.4.3 trace routing routing traces or vias under the gyro package such that they run under the exposed die pad is prohibit ed. routed active signals may harmonically couple with the gyro mems devices, compromising gyro response. these devices are designed with the drive frequenci es as follows: x = 333khz, y = 303khz, and z=273khz. to avoid harmonic coupling don?t route a ctive signals in non-shielded signal planes directl y below, or above the gyro package. note: for best pe rformance, design a ground plane under the e-pad to reduce pcb signal noise from the board on which the gyro device is mounted. if the gyro device is stac ked under an adjacent pcb board, design a ground plane directly above the gyro device to shield active sig nals from the adjacent pcb board. 11.4.4 component placement do not place large insertion components such as key board or similar buttons, connectors, or shielding boxes at a distance of less than 6 mm from the mems gyro. maintain generally accepted industry design practi ces for component placement near the mpu-9150 to preven t noise coupling and thermo-mechanical stress. 11.4.5 pcb mounting and cross-axis sensitivity orientation errors of the gyroscope and acceleromet er mounted to the printed circuit board can cause c ross- axis sensitivity in which one gyro or accel respond s to rotation or acceleration about another axis, respectively. for example, the x-axis gyroscope may respond to rotation about the y or z axes. the orientation mounting errors are illustrated in the figure below.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 43 of 52 package gyro & accel axes ( ) relative to pcb axes ( ) with orientation errors ( and ) m p u - 9 1 5 0 x y z the table below shows the cross-axis sensitivity as a percentage of the specified gyroscope or accelerometer?s sensitivity for a given orientation error, respectively. cross-axis sensitivity vs. orientation error orientation error ( or ) cross-axis sensitivity (sin or sin ) 0o 0% 0.5o 0.87% 1o 1.75% the specifications for cross-axis sensitivity in se ction 6.1 and section 6.2 include the effect of the die orientation error with respect to the package. 11.4.6 mems handling instructions mems (micro electro-mechanical systems) are a time- proven, robust technology used in hundreds of millions of consumer, automotive and industrial pro ducts. mems devices consist of microscopic moving mechanical structures. they differ from conventiona l ic products, even though they can be found in sim ilar packages. therefore, mems devices require different handling precautions than conventional ics prior t o mounting onto printed circuit boards (pcbs). the mpu-9150 has been qualified to a shock tolerance of 10,000 g . invensense packages its gyroscopes as it deems proper for protection against normal handl ing and shipping. it recommends the following handl ing precautions to prevent potential damage. ? do not drop individually packaged gyroscopes, or t rays of gyroscopes onto hard surfaces. components placed in trays could be subject to g -forces in excess of 10,000 g if dropped. ? printed circuit boards that incorporate mounted gy roscopes should not be separated by manually snapping apart. this could also create g -forces in excess of 10,000 g.
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 44 of 52 ? do not clean mems gyroscopes in ultrasonic baths. ultrasonic baths can induce mems damage if the bath energy causes excessive drive motion through r esonant frequency coupling. 11.4.7 esd considerations establish and use esd-safe handling precautions whe n unpacking and handling esd-sensitive devices. ? store esd sensitive devices in esd safe containers until ready for use. the tape-and-reel moisture- sealed bag is an esd approved barrier. the best pra ctice is to keep the units in the original moisture sealed bags until ready for assembly. restrict all device handling to esd protected work areas that measure less than 200v static charge. en sure that all workstations and personnel are properly gr ounded to prevent esd. 11.5 reflow specification qualification reflow: the mpu-9150 was qualified in accordance with ipc/jedec j-std-020d.01. this standard classifies proper packaging, storage and h andling in order to avoid subsequent thermal and mechanical damage during the solder reflow attachme nt phase of pcb assembly. the qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak cycle (in a temperature humidity oven), and three c onsecutive solder reflow cycles, followed by functi onal device testing. the peak solder reflow classification temperature r equirement for package qualification is (260 +5/-0 c) for lead-free soldering of components measuring less th an 1.6 mm in thickness. the qualification profile and a table explaining the set-points are shown below: temperature [c] time [seconds] solder reflow profile for qualification lead-free ir/convection preheat 60-120sec t smax t smin t liquidus t pmin t pmax liquidus 60-120sec 10-30sec t ramp-up ( < 3 c/sec) t ramp-down ( < 4 c/sec) t room-pmax (< 480sec) a b c d e f g h i
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 45 of 52 temperature set points corresponding to reflow prof ile above step setting constraints temp (c) time (sec) max. rate (c/sec) a t room 25 b t smin 150 c t smax 200 60 < t bc < 120 d t liquidus 217 r ( t liquidus - t pmax) < 3 e t pmin [255c, 260c] 255 r (tliquidus-tpmax) < 3 f t pmax [ 260c, 265c] 260 t af < 480 r ( t liquidus - t pmax) < 3 g t pmin [255c, 260c] 255 10< t eg < 30 r ( t pmax - t liquidus) < 4 h t liquidus 217 60 < t dh < 120 i t room 25 notes: customers must never exceed the classification temp erature (t pmax = 260c). all temperatures refer to the topside of the qfn p ackage, as measured on the package body surface. production reflow: check the recommendations of your solder manufactu rer. for optimum results, use lead-free solders that have lower specified tempera ture profiles (tp max ~ 235c). also use lower ramp-up and ramp-down rates than those used in the qualificatio n profile. never exceed the maximum conditions that we used for qualification, as these represent the maxi mum tolerable ratings for the device. 11.6 storage specifications the storage specification of the mpu-9150 conforms to ipc/jedec j-std-020d.01 moisture sensitivity level (msl) 3. calculated shelf-life in moisture-sealed bag 12 mon ths -- storage conditions: <40c and <90% rh after opening moisture-sealed bag 168 hours -- stor age conditions: ambient 30c at 60%rh 11.7 package marking specification invensense mpu9150 xxxxxx-xx xx yyww x lot traceability code foundry code package vendor code rev code yy = year code ww = work week top view part number package marking specification

mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 47 of 52 reel dimensions and package size package size reel (mm) l v w z 4x4 330 100 13.2 2.2 tape and reel specification reel specifications quantity per reel 5,000 reels per box 1 boxes per carton (max) 5 pcs/carton (max) 25,000 label reel cover tape (anti-static) carrier tape (anti-static) terminal tape user direction of feed invensense invensense invensense invensense pin 1 package orientation i n v e n s e n s e p b - f r e e c a t e g o r y ( e 4 ) h f d e v i c e ( 1 p ) : m p u - 6 0 5 0 p o : h u b r e e l q t y ( q ) : 5 0 0 0 l o t 1 ( 1 t ) : q 2 r 7 8 4 - f 1 d / c ( d ) : 1 1 1 8 q t y ( q ) : 3 0 0 0 l o t 2 ( 1 t ) : q 3 v 2 1 5 - g 1 d / c ( d ) : 1 1 0 7 q t y ( q ) : 2 0 0 0 r e e l d a t e : 1 8 / 0 5 / 1 1 q c s t a m p :

mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 49 of 52 11.10 packaging reel ? with barcode & vacuum-sealed moisture msl 3 label caution labels barrier bag with esd, msl3, caution, and barcode labels caution label esd label inner bubble wrap pizza box pizza boxes placed in foam- outer ship per label lined shipper box
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 50 of 52 11.11 representative shipping carton label
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 51 of 52 12 reliability 12.1 qualification test policy invensense?s products complete a qualification test plan before being released to production. the qualification test plan for the mpu-9150 followed t he jesd 47h.01 standards, ?stress-test-driven qualification of integrated circuits,? with the ind ividual tests described below. 12.2 qualification test plan accelerated life tests test method/condition lot quantity sample / lot acc / reject criteria (htol/lfr) high temperature operating life jedec jesd22-a108d, dynamic, 3.63v biased, tj>125c [read-points 168, 500, 1000 hours] 3 77 (0/1) (hast) highly accelerated stress test (1) jedec jesd22-a118a condition a, 130c, 85%rh, 33.3 psia., unbiased, [r ead- point 96 hours] 3 77 (0/1) (hts) high temperature storage life jedec jesd22-a103d, cond. a, 125c non-bias bake [read-points 168, 500, 1000 hours] 3 77 (0/1) device component level tests test method/condition lot quantity sample / lot acc / reject criteria (esd-hbm) esd-human body model jedec js-001-2010, (1.5kv) 1 3 (0/1) (esd-mm) esd-machine model jedec jesd22-a115c, (200v) 1 3 (0/1) (lu) latch up jedec jesd-78d class ii (2), 125c; 100ma 1 6 (0/1 ) (ms) mechanical shock jedec jesd22-b104c, mil-std-883, method 2002.5, cond. e, 10,000 g?s , 0.2ms, x, y, z ? 6 directions, 5 times/direction 3 5 (0/1) (vib) vibration jedec jesd22-b103b, variable frequency (random), cond. b, 5-500hz, x, y, z ? 4 times/direction 1 5 (0/1) (tc) temperature cycling (1) jedec jesd22-a104d condition n [-40c to +85c], soak mode 2 [5?], 100 cycles 3 77 (0/1) board level tests test method/condition lot quantity sample / lot acc / reject criteria (bms) board mechanical shock jedec jesd22-b104c,mil-std-883, method 2002.5, cond. e, 10000 g?s , 0.2ms, +-x, y, z ? 6 directions, 5 times/direction 1 5 (0/1) (btc) board temperature cycling (1) jedec jesd22-a104d condition n [ -40c to +85c], soak mode 2 [5?], 100 cycles 1 40 (0/1) (1) tests are preceded by msl3 preconditioning in accor dance with jedec jesd22-a113f
mpu-9150 product specification document number: ps-MPU-9150A-00 revision: 4.0 release date: 5/14/2012 52 of 52 13 environmental compliance the mpu-9150 is rohs and green compliant. the mpu-9150 is in full environmental compliance as evidenced in report hs-mpu-9150, materials declaration data sheet. environmental declaration disclaimer: invensense believes this environmental information to be correct but cannot guarantee accuracy or comp leteness. conformity documents for the above component constitutes are o n file. invensense subcontracts manufacturing and t he information contained herein is based on data received from vendors and s uppliers, which has not been validated by invensens e. this information furnished by invensense is believe d to be accurate and reliable. however, no responsi bility is assumed by invensense for its use, or for any infringements of patents or other rights of third parties that may result from its use. specifications are subject to change without notice. invensense reserves the righ t to make changes to this product, including its ci rcuits and software, in order to improve its design and/or performance, without prio r notice. invensense makes no warranties, neither e xpressed nor implied, regarding the information and specifications contained in thi s document. invensense assumes no responsibility fo r any claims or damages arising from information contained in this document, or fro m the use of products and services detailed therein . this includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intelle ctual property rights. certain intellectual property owned by invensense a nd described in this document is patent protected. no license is granted by implication or otherwise under any patent or patent rights of invensense. this publication supersedes and replaces all information previously supplied. trademarks that are registered trademarks are the property of their respective co mpanies. invensense sensors should not be used or sold in the development, stor age, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. invensense?, motioncommand?, touchanywhere?, and ai rsign? are registered trademarks of invensense, inc . mpu? , mpu- 9150? , motion processing unit? , motionfusion?, motionprocessing?, motionapps?, di gital motion processor?, digital motion processing?, dmp?, blurfree?, and instantgesture? are trademarks of invensense, inc. ?2011 invensense, inc. all rights reserved.


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